00906na  a2200217   4500001001300000005001500013008004100028024002700069035002700096100001400123370004800137370004800185372005300233372003600286373005800322374005700380377002200437400001900459400001800478670019200496KAC20219927020221226135334210915 b aznnnaabn          fa aaa      7 a00000005049387732isni  a(KISTI)ADPER68017787481 a이강욱  c한국(국명)[韓國]0KSH20000101452nlsh  c일본(국명)[日本]0KSH20000143362nlsh  a전자 공학[電子工學]0KSH19980184202nlsh  a마이크로 일렉트로닉스  a도호쿠대학 New Industry Creation hatchery Center  a연구원(연구자)[硏究員]0KSH19980377142nlsh  l한국어l영어1 aLee, Kang-wook1 aLee, Kangwook  aNano-scale Cu direct bonding technology using ultra-high density, fine size Cu Nano-Pillar (CNP) for exascale 2.5D/3D integrated system, (한국마이크로전자및패키징학회), 2016